NVIDIA and Cisco propose denser optical connections for larger AI networks

Larger AI clusters would gain more network capacity without adding switch layers under a design NVIDIA and Cisco introduced on October 12, 2026. The companies announced plans for USFP, a denser format for removable optical modules, aimed at moving more data through the same physical footprint while preserving a familiar deployment model.

The collaboration was presented at the Open Compute Project Global Summit. USFP stands for Ultra-Dense Small Form Factor Pluggable: a proposed physical format for optical transceivers, the modules that carry network traffic over optical connections.

More connections before another switch layer

When a switch reaches its connection capacity, expanding the network can require additional switches and optical links, increasing latency, power consumption and cost. NVIDIA and Cisco’s proposed remedy is to double both the number of data lanes in each module and the bandwidth carried by each lane.

USFP is designed for electrical signals of 400 gigabits per second per lane. The first planned transceivers would pack 16 full-duplex lanes—carrying data in both directions—into an OSFP-sized footprint. They are intended for switches and SuperNIC network interface cards.

A connector that engages in two steps

USFP uses a two-dimensional array of contacts and a two-step insertion process. High-speed contacts engage after the module has been inserted. The companies say that sequence reduces contact wear, improves signal integrity and makes insertion force more predictable.

The connector is intended to allow later expansion to 32 full-duplex lanes and beyond. The companies say its 400Gb/s design also improves performance at 200Gb/s per lane.

USFP is designed to dissipate up to 100 watts without a separate, dedicated cooling circuit embedded inside the transceiver. NVIDIA and Cisco say this would reduce switch-design complexity and improve reliability. It does not mean the surrounding equipment needs no cooling.

Keeping the module removable—and opening the specification

Cisco’s optical-systems chief Bill Gartner emphasized serviceability and deployment flexibility. The companies are aiming to retain a removable-module operating model as connection speeds rise, rather than asking customers to accept a more complex one.

TE Connectivity and Amphenol are working with NVIDIA and Cisco on USFP cages, connectors and modules. Additional partners are expected to join, giving suppliers a shared physical format for developing higher-density equipment.

An open industry specification is planned through an upcoming community-led, multi-source project. It is not yet a completed standard, and the announcement gives no commercial availability date for the first transceivers.